Research & Reviews: Journal of Material Sciences
MenuISSN:2321-6212
ISSN:2321-6212
Jun-Hyun Kim and Chang-Koo Kim
Ajou University, South Korea
Posters & Accepted Abstracts: Res. Rev. J Mat. Sci
Antireflective surfaces are useful in many applications such as solar cells, light emitting diodes and optical lens systems. Coating anti reflection layers is one of the ways to improve light trapping and decrease the optical reflectivity from the surface. By controlling the refractive index of the coating layer, the destructive interference of light minimizes the reflection. However, the use of hetero materials can limit the thermal stability and eventually the long-term reliability. The surface texturing is another way of producing antireflective surfaces. Surfaces with silicon pillars in various shapes have been shown to exhibit low reflectivity compared with bare surfaces. These pillars are mostly vertical. If the pillars are tilted from the surface normal, more light would be trapped between the pillars. This would result in lower reflectivity of the surfaces. The surface can be textured through either wet or dry etching. Wet chemical etching is very simple to operate, but only crystalline substrates can be used to obtain slanted structures in wet chemical etching. Dry etching using gaseous plasmas offers high aspect ratio structures due to its anisotropic etching characteristics. In a conventional plasma etching process, a sheath is formed along the surface of a substrate, irrespective of its angle. Therefore, simply tilting of a sample is not adequate for obtaining slanted etch profiles during conventional plasma etching. In this study, slanted silicon pillars at arbitrary angles were fabricated using the slanted plasma etching technique. Optical analysis of surfaces with silicon pillars was made to investigate their antireflection properties. It was shown that the reflectance of the surface with Si pillars was affected by the aspect ratio as well as the opening area of the pillars. Recent Publications 1. Jun-Hyun Kim, Jeong Geun Bak, Kangtaek Lee and Chang-Koo Kim (2018) Control of the electrical resistivity of Ni-Cr wires using low pressure chemical vapor deposition of tin. Applied Surface Science 429:134-137. 2. Jun-Hyun Kim, Sung-Woon Cho and Chang-Koo Kim (2017) Angular dependence of Si3N4 etching in C4F6/CH2F2/O2/ Ar plasmas. Chemical Engineering and Technology 40(12):2251-2256. 3. Jun-Hyun Kim, Sung-Woon Cho, Chang Jin Park, Heeyeop Chae and Chang-Koo Kim (2017) Angular dependences of SiO2 etch rates at different bias voltages in CF4, C2F6, and C4F8 plasmas. Thin Solid Films 637:43-48. 4. Sung-Woon Cho, Jun-Hyun Kim, Hae-Min Lee, Heeyeop Chae and Chang-Koo Kim (2016) Super hydrophobic Si surfaces having microscale rod structures prepared in a plasma etching system. Surface and Coatings Technology 306:82- 86. 5. Jun-Hyun Kim, Sung-Woon Cho, Doo Won Kang, Kyung Mi Lee, Chang Yong Baek, Hae-Min Lee and Chang-Koo Kim (2016) Electrical, structural, and morphological characteristics of dopantless tin oxide films prepared by low pressure chemical vapor deposition. Science of Advanced Materials 8(1):117-121.
Jun-Hyun Kim has completed his BS and MS degrees in Chemical Engineering at Ajou University, Suwon, South Korea in 2011 and 2013 respectively. He is currently a PhD candidate in Chemical Engineering at Ajou University. He has expertise in Plasma Processing, especially Plasma Etching.
E-mail: kairi0401@ajou.ac.kr