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Volume 5, Issue 6 (Suppl) J Mat. Sci.
ISSN: 2321-6212 Advanced Materials 2017
October 26-28, 2017
OCTOBER 26-28, 2017 OSAKA, JAPAN
13TH INTERNATIONAL CONFERENCE ON
Advanced Materials and Nanotechnology
Improvement of metallic nanostructure fabrication using electrochemical migration
Shintaro Fukaya, T Aoki, Y Kimura and M Saka
Tohoku University, Japan
The metallic nanostructure has the physical properties as remarkable increase in surface-to-volume ratio and the
development of nanostructure fabrication has revolutionized many applications ranging from electronics to photonics,
information strage and sensing, as well as energy conversion and storage. Electrochemical Migration (ECM) is known as a
cause of invoking insulation deterioration on the printed circuit board in high-humid and high temperature environment.
Although a considerable number of studies have been reported on suppressing ECM, utilization using ECM has not really
been studied so far. The previous studies of suppressing reveal that eluting metal grows as dendrites. Recent years, the concern
with utilization using ECM has been growing because ECM is the low cost and green fabrication technique and the reaction is
caused by DC voltage and water. The attempt has been made at fabricating the metallic nanostructure using ECM. However,
it has reported that ECM stops during growth of dendrites between electrodes because dendrites form short circuit. Thus, the
sustainable and large-scale fabrication for the metallic nanostructure has not been established. The purpose of this study is
to demonstrate sustainable and large-scale fabrication for the metallic nanostructure using ECM. In this study, we changed
experimental conditions and evaluated these results.
Biography
Shintaro Fukaya has received his Bachelor of Engineering degree in 2017 from Tohoku University, Japan. He is currently a graduate student in Saka-Laboratory
of Tohoku University.
Shintaro Fukaya et al., J Mat. Sci. 2017, 5:6
DOI: 10.4172/2321-6212-C1-008