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Volume 6 Research & Reviews: Journal of Material Sciences Advanced Materials 2018
September 19-21, 2018
September 19-21, 2018 Tokyo, Japan
22nd International Conference on
Advanced Materials and Nanotechnology
Eon Ju Lee et al., Shi-Ru et al., Res. Rev. J Mat. Sci. 2018, Volume 6
DOI: 10.4172/2321-6212-C4-024
Synthesis and characterization of highly conductive nanoparticle copper ink for inkjet printing
Eon Ju Lee, Ho Young Jun and Si Ok Ryu
Yeungnam University, Republic of Korea
Many industries are focused on the nanoparticle metallic inks for the fabrication of electronic devices. Silver ink is a typical
metallic ink having high conductivity and thermal stability. However, there is a limitation to use it in the fabrication
due to its high material cost. Copper is considered as a substitute material for silver, but copper ink has an oxidation issue
under atmospheric conditions. Cost effective, highly conductive and oxidation-free copper nanoparticle ink was synthesized
in this study. Copper complexes and copper nanoparticles were used in the synthesis to prevent its oxidation. Expanding
its application to various substrates, the synthesized nanoparticles were thermally treated at relatively low temperatures
in the range of 50~400 oC. The prepared copper ink was printed on the silicon substrates and the printed films were then
characterized. Each particle of copper complexes and copper nanoparticles was analyzed by Thermogravimetric Analyzer
(TGA). Sheet-resistance was measured by four point probe. Surface morphology of the prepared electrode was also analyzed
using Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM). From our results, the synthesized
copper ink showed the suitable properties to apply to inkjet printing process for the fabrication of various electronic devices.
Biography
Eon Ju Lee has completed her Bachelor's degree in Chemical Engineering from Yeungnam University and currently pursuing her Master’s degree at Yeungnam
University. Her main research topic is the synthesis and application of highly conductive nanoparticle copper ink.