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conferenceseries
.com
Volume 6
Research & Reviews: Journal of Material Sciences
MatSciEngg 2018
October 15-17, 2018
October 15-17, 2018 Helsinki, Finland
31
st
Materials Science and Engineering
Conference: Advancement & Innovations
Investigation of cyanoacrylate adhesive bond curing and durability using Raman spectroscopy and
electrochemical impedance spectroscopy
Kevin Raheem
Focas Research Institute, Ireland
C
yanoacrylate (CA) polymerization is normally triggered by traces of basic
substances at the adhesive/substrate interface resulting in rapid formation
of large molecular weight polymers. However there are some disadvantages, for
instance, increasing the bond gap from 10 microns (zero gap bonds) to 100 microns
can increase bond fixture time from a few seconds up to several minutes, sometimes
limiting their service capabilities. The aim of this work is to use Raman spectroscopy
and other surface analytical and chemical laboratory techniques to gain improved
understanding of the processes responsible for performance limitations of such
adhesives. Raman will be employed to provide insights into the rates and mechanisms of the interfacial CA polymerization
process, which are known to be independent of bulk polymerization processes. In addition, the examination of the time-
dependent and spatial behavior of EIS data in conjunction with a mathematical model based on the diffusion of monomeric
and/or polymeric species through the adhesive volume will aid our understanding of the polymerization processes occurring
in various regions of the adhesive bond including the edge and the bulk material. By studying the effects of chemical and
physical variations the fundamental questions regarding the degradation of adhesive joints by environmental stress will be
addressed thereby enhancing our knowledge of the hydrolytic stability of CA adhesive bond.
kevin.raheem@mydit.ieKevin Raheem, Res. Rev. J Mat. Sci. 2018, Volume 6
DOI: 10.4172/2321-6212-C5-026