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conferenceseries
.com
Volume 5, Issue 6 (Suppl)
J Mat. Sci.
ISSN: 2321-6212
Advanced Materials 2017
October 26-28, 2017
OCTOBER 26-28, 2017 OSAKA, JAPAN
13
TH
INTERNATIONAL CONFERENCE ON
Advanced Materials and Nanotechnology
Joining of SiC
f
/SiC using preceramic polymers
Dong Hyuk Jeong, Pipit Fitriani, Amit S Sharma and Dang-Hyok Yoon
Yeungnam University, Republic of Korea
S
iC
f
/SiC possesses great potential for applications in severe conditions, including high temperatures and structural
components for future fusion reactors. Various fabrication techniques have been developed to fabricate SiC
f
/SiC, which
generally produce simple shape, such as plates and tubes. However, their practical utility can only be realized by integrating
simple shapes into complex geometries. Therefore, considerable research efforts are being directed to develop filler materials,
which can be employed to join SiC
f
/SiC. However, SiC-based fillers being similar to the SiC
f
/SiC joining body are a natural
choice to preserve the outstanding properties of SiC
f
/SiC. Taking this into consideration, we tried to obtain pure SiC joining
filler by pyrolyzing the preceramic polymers, such as Polycarbosilane (PCS) and Polysilazane (PSZ). Both of PCS and PSZ
were applied in a paste form followed by thermal treatment, where SiC was the main products along with the presence of
small amount of Si
3
N
4
, depending on the starting material. Because cracks and pores might be generated by the vaporization
of gaseous products, which can hamper the overall joining properties, careful optimization for the polymeric composition,
choice of filler, heating rate, joining temperature and pressure was performed. A slow heating rate of 2 °C/min was employed
for the temperatures of 1600-1700 °C to obtain sound and crack-free joints, while the pressure of 3.5 and 20 MPa was applied.
The joining strength was estimated by 3-point bending test and correlated with the interfacial microstructure, mode of failure
as well as the joint thickness.
Biography
Dong Hyuk Jeong is pursuing his graduation from the School of Materials Science and Engineering at Yeungnam University, Republic of Korea. His current research
is on the joining of SiC
f
/SiC for high temperature and nuclear reactor applications.
cdh2090@ynu.ac.krDong Hyuk Jeong et al., J Mat. Sci. 2017, 5:6
DOI: 10.4172/2321-6212-C1-008